Huawei touts chip breakthrough to shorten gap with TSMC
Huawei Technologies has announced a new pathway to close the gap with TSMC in semiconductor manufacturing. The company plans to produce 1.4-nanometer chips by 2031 using its own LogicFolding technology, which does not rely on ASML's advanced lithography machines. This development could significantly enhance Huawei's chipmaking capabilities and challenge existing industry norms.
- ▪Huawei aims to produce 1.4-nanometer chips by 2031 using its LogicFolding technology.
- ▪Currently, there is a five-year gap between TSMC's capabilities and Huawei's production.
- ▪Shares of major Chinese chip firms rose significantly following Huawei's announcement.
5 outlets in our directory ran this story, first to last over 9 hours. Coverage spans 2 points on the political spectrum — 1 lean left, 2 centre.
- ▪ China’s Huawei touts chip design breakthrough in bid to defy U.S. sanctions — NBC News — Top
- ▪ China’s Huawei reveals chip design breakthrough amid U.S. sanctions — Japan Times
- ▪ Chinese chipmaking stocks rally on Huawei chip design breakthrough — Investing.com — News
- ▪ China's Huawei reveals chip design breakthrough amid US sanctions - Reuters — Google News
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| Original publisher | Fortune |
| Canonical URL | https://fortune.com/2026/05/25/huawei-touts-chip-breakthrough-to-shorten-gap-with-tsmc/ |
| Publication time | Mon, 25 May 2026 12:09:35 +0000 |
| Retrieval time | 2026-05-25T12:42:36.699Z |
| Last seen | 2026-05-25T12:42:36.699Z |
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| Cluster | 8KSHD5gI33jS · 6 stories |
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Opening excerpt (first ~120 words) tap to expand
Huawei Technologies Co. said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co., potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment.Recommended Video Right now there is about a five-year gap between what TSMC is capable of and what Huawei together with its manufacturing partner Semiconductor Manufacturing International Corp. can produce. Huawei will start making 1.4-nanometer chips by 2031 with its own “LogicFolding” technology, Huawei’s semiconductor chief He Tingbo said in a rare public appearance during a chip conference on Monday, while TSMC has said that it will begin mass production of the same product in 2028.
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