Huawei unveils new smartphone chips this fall as rivalry with Nvidia and Apple heats up
Huawei has introduced a new engineering approach called 'LogicFolding' for its Kirin smartphone chips, aiming to enhance semiconductor development despite U.S. sanctions. This announcement comes as Nvidia faces challenges in the Chinese market due to export restrictions, and Apple experiences increased competition from Huawei. The Chinese tech giant's advancements could potentially allow it to achieve capabilities comparable to 1.4-nanometer technology by 2031, although some experts remain skeptical about these claims.
- ▪Huawei has developed a new engineering approach called 'LogicFolding' for its Kirin smartphone chips.
- ▪Nvidia is struggling to sell its high-end chips in China due to U.S. export restrictions.
- ▪Huawei's Mate 60 smartphone, launched in 2023, features 5G connectivity powered by an advanced chip.
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| Original publisher | CNBC — Top |
| Canonical URL | https://www.cnbc.com/2026/05/25/huawei-chip-logicfolding-semiconductor-nvidia-china.html |
| Publication time | Mon, 25 May 2026 05:57:43 GMT |
| Retrieval time | 2026-05-25T06:12:36.209Z |
| Last seen | 2026-05-25T06:12:36.209Z |
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SHANGHAI — Chinese tech giant Huawei on Monday touted a new approach to developing advanced semiconductors despite U.S. sanctions, as Nvidia struggles to sell its high-end chips in China.Huawei said it developed a new engineering approach called "LogicFolding" to manufacture its Kirin smartphone chips this fall.That breakthrough comes as Nvidia faces U.S. export restrictions in China and Apple contends with renewed competition from Huawei in the world's second-largest consumer economy.Huawei's Mate 60 smartphone, launched in 2023, included 5G connectivity powered by an advanced chip that helped the company regain market share from Apple. While U.S.
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