Huawei's new stacking tech for high-capacity SSDs

Chris Mellor· May 23, 2026 · 4:51 AM UTC ·3 min read · 0 reactions · 0 comments · 38 views

TL;DR · WeSearch summary

Huawei has developed high-capacity SSDs using its proprietary Die-on-Board (DoB) technology, achieving up to 122 TB without access to the latest 3D NAND from US suppliers. This innovation allows for greater capacity density and reduced costs compared to traditional packaging methods. The company aims to compete with mainstream SSD suppliers by producing SSDs with impressive performance metrics and future plans for even larger capacities.

Key facts

▪Huawei's new SSDs utilize Die-on-Board packaging to achieve high capacities of 61.44 TB and 122.88 TB.
▪The DoB technology provides a 33% improvement in capacity density over traditional methods.
▪Huawei's OceanStor Pacific 9926 can achieve 4.42 PB of raw capacity using its 122.88 TB SSDs.

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Publication time	Sat, 23 May 2026 04:51:29 +0000
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(function() { let windowUrl = window.location.href; windowUrl = windowUrl.substring(windowUrl.indexOf('?') + 1); let messageElement = document.querySelector('.shareableMessage'); if (windowUrl && windowUrl.includes('code') && windowUrl.includes('expires')) { messageElement.style.display = 'block'; } })(); flash Huawei’s new stacking tech for high-capacity SSDs Chris Mellor Chris Mellor Blocks & Files editor Published thu 21 May 2026 // 14:43 UTC Huawei has produced 122 TB SSDs without having access to the latest 100+ layer 3D NAND from mainstream NAND suppliers, and it has done this using proprietary Die-on-Board (DoB) packaging.DoB is a wafer-level packaging or assembly technology that places dies (NAND dies for example) directly onto a base printed circuit board (PCB).

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