Memory has grown to nearly two-thirds of AI chip component costs
High-bandwidth memory (HBM) has increased its share of AI chip component costs significantly. From Q1 2024 to Q4 2025, HBM's share rose from 52% to 63%, while other components saw declines. The absolute spending on HBM also surged from $12 billion to $32 billion during this period.
- ▪HBM has grown from 52% to 63% of total AI chip component spending between Q1 2024 and Q4 2025.
- ▪Logic dies remained stable at around 13%, while advanced packaging and auxiliary components saw declines.
- ▪The absolute spending on HBM increased from approximately $12 billion in 2024 to $32 billion in 2025.
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| Original publisher | Epoch AI |
| Canonical URL | https://epoch.ai/data-insights/ai-chip-component-cost-shares |
| Publication time | Sun, 24 May 2026 16:31:29 +0000 |
| Retrieval time | 2026-05-24T16:52:33.909Z |
| Last seen | 2026-05-24T16:52:33.909Z |
| Headline source | Publisher (no WeSearch rewrite) |
| Excerpt source | publisher body |
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| Summary | WeSearch · cerebras-chat (WeSearch summarizer) |
| Summary source text | contentText |
| Citation coverage | Summary is a WeSearch-generated derivative; primary citation is the original publisher URL. |
| Cluster | AsjNh8ww5G5j |
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| Ranking reason | Story pages are not engagement-ranked. Hub feeds use recency, with optional source-diversified chronological ordering (cap consecutive stories per source). No personalized ranking. |
| Publisher visit | Yes — open original |
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| Retrieval / RAG | May the content be exposed for third-party retrieval-augmented generation? | Not asserted |
| Model training | May the content be used to train AI models? | Not asserted |
| Commercial reuse | May the content be reused commercially? | Not permitted |
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Opening excerpt (first ~120 words) tap to expand
High-bandwidth memory (HBM) has grown from 52% to 63% of total AI chip component spending between Q1 2024 and Q4 2025. These estimates are an average across all AI chips designed by Nvidia, AMD, Google, and Amazon, weighted by production volume. As a share of spend, logic dies stayed roughly flat near 13%, while advanced packaging fell from 19% to 15% and auxiliary components fell from 15% to 9%. In absolute terms, HBM spend across these four designers grew from roughly $12 billion in 2024 to $32 billion in 2025, a faster year-over-year increase than any other component.
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Excerpt limited to ~120 words for fair-use compliance. The full article is at Epoch AI.
