PC Silicon Is Evolving Way Faster Than Laptop Design. This Company Has a Cool Solution
AI-focused laptops are facing thermal challenges as processors become more powerful. Ventiva, a Fremont-based company, offers solid-state ionic cooling modules that replace traditional fans and claim to free up motherboard space. The firm says its Malaysian automated factory can produce millions of these fan-less modules, enabling closer memory placement and quieter, more flexible laptop designs.
- ▪Ventiva designs solid-state ionic cooling modules with no moving parts, eliminating the need for spinning fans in laptops.
- ▪Removing fans frees up space on the motherboard, allowing memory to be placed closer to the CPU for high‑bandwidth AI workloads.
- ▪The technology promises quieter operation by reducing vibration and noise associated with traditional cooling fans.
- ▪Ventiva operates an automated manufacturing facility in Malaysia that can scale production to millions of modules.
- ▪The company positions its solution as a way to address heat and space constraints in AI‑centric laptops, supporting larger memory capacities.
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| Original publisher | PCMag |
| Canonical URL | https://www.pcmag.com/news/ventiva-fanless-laptop-design-ionic-cooling-computex-2026 |
| Publication time | Sat, 13 Jun 26 12:00:00 +0000 |
| Retrieval time | 2026-06-13T12:33:54.534Z |
| Last seen | 2026-06-13T12:33:54.534Z |
| Headline source | Publisher (no WeSearch rewrite) |
| Excerpt source | publisher body |
| Excerpt method | First ~120 words (~800 chars) of extracted publisher body, fair-use limited. |
| Summary | WeSearch · cerebras-chat (WeSearch summarizer) |
| Summary source text | contentText |
| Citation coverage | Summary is a WeSearch-generated derivative; primary citation is the original publisher URL. |
| Cluster | oO5rAt-9XVTf |
| Cluster logic | Grouped by semantic title/content similarity across sources within a rolling window. Same-publisher template collisions are excluded from coverage comparison. |
| Ranking reason | Story pages are not engagement-ranked. Hub feeds use recency, with optional source-diversified chronological ordering (cap consecutive stories per source). No personalized ranking. |
| Publisher visit | Yes — open original |
| Substitutes article? | No — link-out required for full text |
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| Indexing | May the item be indexed (stored, ranked, made findable)? | Allowed |
| Snippet | May a short excerpt of the publisher's text be shown? | Allowed |
| AI summary | May WeSearch generate its own short summary of the article? | Limited |
| Retrieval / RAG | May the content be exposed for third-party retrieval-augmented generation? | Not asserted |
| Model training | May the content be used to train AI models? | Not asserted |
| Commercial reuse | May the content be reused commercially? | Not permitted |
Basis: Derived from the published RSS/Atom feed. Contact: [email protected]. Reviewed: 2026-07-24.
Opening excerpt (first ~120 words) tap to expand
TAIPEI—As the AI PC era becomes a runaway train, laptop makers face an old nemesis: heat generated by hot-running chips. New AI-focused processors pack ever more CPU, GPU, and NPU horsepower into increasingly thin machines. But the basic approach to cooling them hasn't changed much in decades: The humble spinning fan remains one of the biggest constraints on laptop design.Ventiva says it's time to rethink how we do things.At Computex 2026, I met with Carl Schlachte, the chairman, president, and CEO of Ventiva, a 62-person company based in Fremont, Calif., that has designed solid-state "ionic cooling" modules with no moving parts. The pitch isn't merely quieter laptops.
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Excerpt limited to ~120 words for fair-use compliance. The full article is at PCMag.
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