Samsung shows first HBM5 mockup with Heat Path Block cooling — thermal race with SK hynix shaping up
Samsung has unveiled its first mockup of HBM5 memory featuring a new cooling design called Heat Path Block at Computex 2026. This development comes as both Samsung and SK hynix focus on addressing heat management in high-bandwidth memory systems. The competition between the two companies is intensifying as they both target the same thermal challenges in their memory architectures.
- ▪Samsung showcased its HBM5 memory mockup with Heat Path Block cooling at Computex 2026.
- ▪SK hynix recently introduced its own thermal design, iHBM, targeting similar heat management issues.
- ▪Samsung plans to manufacture HBM5's base die using its in-house 2nm process technology.
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| Publication time | Wed, 03 Jun 2026 15:30:51 +0000 |
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Tech Industry Manufacturing Semiconductors Samsung shows first HBM5 mockup with Heat Path Block cooling — thermal race with SK hynix shaping up News By Luke James published 3 June 2026 Both memory leaders now target the same die-to-die hotspot with rival in-package cooling designs. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. (Image credit: Future) Share Copy link Facebook X Whatsapp Reddit Pinterest Flipboard Email Share this article Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our newsletter Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei.
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